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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
16 x 4 Bit Register File (RAM)
The MC10H145 is a 16 x 4 bit register file. The active-low chip select allows easy expansion. The operating mode of the register file is controlled by the WE input. When WE is "low" the device is in the write mode, the outputs are "low" and the data present at Dn input is stored at the selected address, when WE is "high," the device is in the read mode -- the data state at the selected location is present at the Qn outputs. * Address Access Time, 4.5 ns Typical * Power Dissipation, 700 mW Typical * Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) * Voltage Compensated * MECL 10K-Compatible MAXIMUM RATINGS
Characteristic Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current -- Continuous -- Surge Operating Temperature Range Storage Temperature Range -- Plastic -- Ceramic Symbol VEE VI Iout TA Tstg Rating -8.0 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA C C Write "0" Write "1" Read Disabled Unit mA A A Vdc Vdc Vdc Vdc CS D1 D0 A3 A2 VEE Q1 Q0 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Q2 Q3 WE D3 D2 A0 A1 MODE CS L L L H
MC10H145
L SUFFIX CERAMIC PACKAGE CASE 620-10 P SUFFIX PLASTIC PACKAGE CASE 648-08 FN SUFFIX PLCC CASE 775-02
TRUTH TABLE
INPUT WE L L H X Dn L H X X OUTPUT Qn L L Q L
ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (See Note)
Characteristic Power Supply Current Input Current High Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Symbol IE IinH IinL VOH VOL VIH VIL 0 Min -- -- 0.5 Max 160 375 -- Min -- -- 0.5 25 Max 163 220 -- Min -- -- 0.3 75 Max 165 220 -- -0.735 -1.60 -0.735 -1.45
Q-State of Addressed Cell
DIP PIN ASSIGNMENT
-1.02 -0.84 -0.98 -0.81 -0.92 -1.95 -1.63 -1.95 -1.63 -1.95 -1.17 -0.84 -1.13 -0.81 -1.07 -1.95 -1.48 -1.95 -1.48 -1.95
NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50-ohm resistor to -2.0 volts.
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6-11 of the Motorola MECL Data Book (DL122/D).
3/93
(c) Motorola, Inc. 1996
2-233
REV 5
MC10H145
AC PARAMETERS
MC10H145 TA = 0 to +75C, VEE = -5.2 Vdc 5% Characteristics Read Mode Chip Select Access Time Chip Select Recovery Time Address Access Time Write Mode Write Pulse Width Data Setup Time Prior to Write Data Hold Time After Write Address Setup Time Prior to Write Address Hold Time After Write Chip Select Setup Time Prior to Write Chip Select Hold Time After Write Write Disable Time Write Recovery Time Chip Enable Strobe Mode Data Setup Prior to Chip Select Write Enable Setup Prior to Chip Select Address Setup Prior to Chip Select Data Hold Time After Chip Select Write Enable Hold Time After Chip Select Address Hold Time After Chip Select Chip Select Minimum Pulse Width Rise and Fall Time Address to Output CS to Output Capacitance Input Capacitance Output Capacitance Symbol tACS tRCS tAA tW tWSD tWHD tWSA tWHA tWSCS tWHCS tWS tWR tCSD tCSW tCSA tCHD tCHW tCHA tCS tr, tf Min 0 0 0 6.0 0 1.5 3.5 1.5 0 1.5 1.0 1.0 0 0 0 1.0 0 2.0 4.0 0.6 0.6 Cin Cout -- -- Max 4.0 4.0 6.0 ns -- -- -- -- -- -- -- 4.0 4.0 ns -- -- -- -- -- -- -- ns 2.5 2.5 pF 6.0 8.0 Unit ns Conditions Measured from 50% of input to 50% of output. See Note 2.
tWSA = 3.5 ns Measured at 50% of input to 50% of output. tW = 6.0 ns.
Guaranteed but not tested on standard product. See Figure 1.
Measured between 20% and 80% points. Measured with a pulse technique.
NOTES: 1. Test circuit characteristics: RT = 50 , MC10H145. CL 5.0 pF (including jig and Stray Capacitance). Delay should be derated 30 ps/pF for capacitive loads up to 50 pF. 2. The maximum Address Access Time is guaranteed to be the worst-case bit in the memory. 3. For proper use of MECL in a system environment, consult MECL System Design Handbook.
p
FIGURE 1 -- CHIP ENABLE STROBE MODE
A TCSD DIN TCSW TCHA
TCHD TCHW
WE
CS
TCSA
TCS
MOTOROLA
2-234
MECL Data DL122 -- Rev 6
MC10H145
BLOCK DIAGRAM
Q0 2
DATA OUT BUFFER
Q1 1
DATA OUT BUFFER
Q2 15
DATA OUT BUFFER
Q3 14
DATA OUT BUFFER
CS 3
CHIP SELECT BUFFER
SENSE A0 10
SENSE
SENSE
SENSE
A1 7
Address Buffer/ 1/16 Decoder
9
16 X 4 MEMORY CELL ARRAY
A2
A3
6 WRITE AND DATA IN BUFFER 5 4 11 12
13
WE
D0
D1
D2
D3
MECL Data DL122 -- Rev 6
2-235
MOTOROLA
MC10H145
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE C
B -N- Y BRK D -L- -M- W D Z
0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X V VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H
0.007 (0.180) M T L-M
S
N
S
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -T-
SEATING PLANE
K1 K F VIEW S 0.007 (0.180)
M
VIEW S
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
MOTOROLA
2-236
MECL Data DL122 -- Rev 6
MC10H145
OUTLINE DIMENSIONS
L SUFFIX CERAMIC DIP PACKAGE CASE 620-10 ISSUE V
9
-A-
16
-B-
1 8
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
-T-
SEATING PLANE
N E F D G
16 PL
K M J
16 PL
0.25 (0.010)
M
M
TB
S
0.25 (0.010)
TA
S
-A-
16 9
P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 or 602-303-5454 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MECL Data DL122 -- Rev 6 2-237
*MC10H145/D*
MC10H145/D MOTOROLA

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